PCB Manufacturing Supplier
Who we are
- 30+ years experience
- 6000+ Customers
- 500+ wokers
- 60+ Engineers
- 20,000 ㎡ workshop
What we do
- FR4 PCB(Rigid PCB)
- Flexible PCB
- Rigid-Flex PCB
- Metal Core PCB
- Aluminum Core PCB
- Ceramic PCB
- HDI PCB
- Impedance Control PCB
- Gold Finger PCB
- Buried Hole PCB
PCB Manufacturing Capability
| Feature | Capability |
| PCB Type | Rigid PCB(CEM, FR4), Flexible PCB, Rigid-Flex PCB, MCPCB(Aluminum PCB), Ceramic PCB, RF PCB, etc. |
| Number of Layers | 1 – 32layers |
| Order Quantity | 1pc – 10,000,000 pcs |
| Build Time | 2days – 5weeks (Expedited Service) |
| Material | FR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C, FR4-Halogen-free, FR4-Halogen-free & High-Tg |
| Board Size | Min 6*6mm | Max 600*700mm |
| Board size tolerance | ±0.1mm – ±0.3mm |
| Board Thickness | 0.4mm – 3.2mm |
| Board Thickness Tolerance | ±0.1mm – ±10% |
| Copper Weight | 0.5oz – 6.0oz |
| Inner Layer Copper Weight | 0.5oz – 2.0oz |
| Copper Thickness Tolerance | +0μm +20μm |
| Min Tracing/Spacing | 3mil/3mil |
| Solder Mask Sides | As per the file |
| Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
| Silkscreen Sides | As per the file |
| Silkscreen Color | White, Blue, Black, Red, Yellow |
| Surface Finish | HASL – Hot Air Solder Leveling Lead Free HASL – RoHS ENIG – Electroless Nickle/Immersion Gold – RoHS ENEPIG – Electroless Nickel Electroless Palladium Immersion Gold – RoHS Immersion Silver – RoHS Immersion Tin – RoHS OSP -Organic Solderability Preservatives – RoHS |
| Min Annular Ring | 3mil |
| Min Drilling Hole Diameter | 6mil, 4mil-laser drill |
| Min Width of Cutout (NPTH) | 0.8mm |
| NPTH Hole Size Tolerance | ±.002″ (±0.05mm) |
| Min Width of Slot Hole (PTH) | 0.6mm |
| PTH Hole Size Tolerance | ±.003″ (±0.08mm) – ±.006″ (±0.15mm) |
| Surface/Hole Plating Thickness | 20μm – 30μm |
| SM Tolerance (LPI) | .003″ (0.075mm) |
| Aspect Ratio | 1.10 (hole size: board thickness) |
| Test | 10V – 250V, flying probe or testing fixture |
| Impedance tolerance | ±5% – ±10% |
| SMD Pitch | 0.2mm(8mil) |
| BGA Pitch | 0.2mm(8mil) |
| Chamfer of Gold Fingers | 20, 30, 45, 60 |
| Other Techniques | Gold fingers Blind and Buried Holes peelable solder mask Edge plating Carbon Mask Kapton tape Countersink/counterbore hole Half-cut/Castellated hole Press fit hole Via tented/covered with resin Via plugged/filled with resin Via in pad Electrical Test |
What We are Doing
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